Description

SQ-730002 single-component UV adhesive is mainly used for bonding glass, stainless steel, aluminum and other substrates. Especially in the bonding of glass and metal films, the bonding force is very strong. The product has the characteristics of low viscosity, strong adhesion, high transparency and good weather resistance. It can be used for bonding and sealing materials in electronic components, toys, handicrafts, gifts, mobile phone sheaths and other fields.

Technical Data

Product Features

Good adhesion to glass, stainless steel, aluminum and other substrates, and high bonding strength;

Fast curing speed, positioning in 1 second, complete curing in 10-20 seconds;

Good resistance to yellowing and good transparency;

Low volume shrinkage;

It has good resistance to high and low temperatures, high humidity, moisture resistance, and UV resistance. The product performance remains stable in harsh environments.

Applications

Suitable for bonding and sealing materials used in smartphones, laptops, household appliances, electronic components, toys, crafts, gifts, and mobile phone cases.It provides excellent adhesion strength for bonding between metal, glass, fiber materials, and rigid plastics. Ideal for electronic products and other applications requiring secure, fixed bonding.

Application Process

1. At least one of the substrates must be transparent. Ensure all bonding surfaces are thoroughly cleaned, dry, and free of oil or contaminants.

2. Apply the UV adhesive to one of the substrate surfaces. Join the two substrates and press firmly using appropriate tools to ensure intimate contact and eliminate air bubbles. The adhesive can be applied manually or via an automatic dispensing machine.

3. Expose the bonded area to UV light with a wavelength of 265 nm or 395 nm. Irradiation should proceed from the center outward, ensuring the light fully penetrates the bonding interface. A typical exposure time is approximately 6 seconds for initial positioning. After preliminary curing, remove any excess adhesive around the bonded area and re-expose to UV light until the adhesive is fully cured. The total curing time varies depending on the substrate type, adhesive layer thickness, and UV intensity. It is recommended to use a UV intensity meter to verify lamp output before bonding to reduce defect rates.

4. Ambient temperature affects adhesive reactivity; lower temperatures may require extended curing times. Avoid excessive pressure or repeated rubbing of the substrates during bonding. Use appropriate fixtures or jigs to maintain alignment and ensure optimal bonding performance.

Process Flow

Apply adhesive onto the cleaned substrate → Mold rolling → UV curing → Setting the shape, removing residual glue → UV curing to improve performance

Precautions

1. Ensure that the UV adhesive layer receives sufficient UV energy to achieve complete curing; inadequate irradiation may compromise the coating performance.

2. Do not pour leftover adhesive back into the original container. Store the remaining material in a sealed, light-proof condition at room temperature.

Storage Conditions

To prevent premature polymerization due to the high reactivity of this product, keep it tightly sealed and store away from heat sources and direct sunlight. It is recommended to maintain storage temperature below 30 °C. Unused product should be promptly resealed and must not be left open. Under ventilated conditions at 25 °C, the product has a safe storage period of 6 months. Available packaging: 1 kg / 5kg / 25 kg per drum

Tips: SQ-730002 UV adhesive for hardware glass, specially used for bonding glass and hardware, fast curing speed, positioning in 1 second, strong adhesion, high transparency, and good weather resistance.

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Note: Technical data represents typical values only. In view of the differences in formulas, production process, conditions, all the above statements must be adjusted according to the actual situation, our company does not make any promises. Our company reserves the right to reform its products without prior notice of any changes.